Silicon-based MEMS array loudspeaker

一种硅基mems阵列扬声器

Abstract

本发明涉及一种硅基MEMS阵列扬声器,包括基板,多个MEMS微声单元,多个MEMS微声单元阵列在基板上;MEMS微声单元包括作为中间电极的振膜、连接在振膜上下表面的上绝缘片和下绝缘片以及作为上电极的上传导板和作为下电极的下传导板,上传导板安装在上绝缘片上,下传导板安装在下绝缘片上,所述上绝缘片和下绝缘片上都设有中心孔,上传导板设有多个与中心孔连通的发音孔,下传导板上设有与中心孔连通的通气孔。本发明具有厚度薄,音质好等特点。
The invention relates to a silicon-based MEMS array loudspeaker. The silicon-based MEMS array loudspeaker comprises a substrate and multiple MEMS micro-acoustic units; the multiple MEMS micro-acoustic units are arrayed on the substrate; each MEMS micro-acoustic unit comprises a vibrating diaphragm, an upper insulation sheet, a lower insulation sheet, an upper conductive plate and a lower conductive plate; the vibrating diaphragm is used as an intermediate electrode; the upper insulation sheet and the lower insulation sheet are connected to the upper and lower surfaces of the vibrating diaphragm; the upper conductive plate is used as an upper electrode; the lower conductive plate is used as a lower electrode; the upper conductive plate is installed on the upper insulation sheet; the lower conductive plate is installed on the lower insulation sheet; the upper insulation sheet and the lower insulation sheet are each provided with a centre hole; the upper conductive plate is provided with multiple pronunciation holes communicated with the centre hole; and the lower conductive plate is provided with a ventilation hole communicated with the centre hole. The silicon-based MEMS array loudspeaker disclosed by the invention has the characteristics of being thin in thickness, good in sound quality and the like.

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